American Precision Dicing began dicing hard brittle materials with only two sawing tools in a garage back in the early 1990s. Over time, the company has evolved into one of the leading dicing facilities in the US. Currently, we have a stable of sawing tools ranging from 100mm capabilities up to 300mm capabilities. In 2006 we established the Laser Services Group as a division of APD. This division was tasked with developing processes utilizing the Synova Laser Microjet, LMJ. The LMJ is the latest cutting technology designed for the semiconductor industry.
We now have the ability to cut non linear lines into various materials. This allows engineers to create more complex geometries which were restricted due to the traditional sawing processes. Our Laser Services Group provides services to start-ups as well as fortune 500 companies worldwide. Low volume quick turn projects are our specialty. Some projects are completed the same day material arrives. Looking forward we will continue to expand into other services within the semiconductor industry as well as expand our tooling capabilities.
American Precision Dicing and Laser Services Group are now ITAR certified.