We provide a number of services that are part of the laser RIP process. These processes are managed by APD’s Laser Services Group to allow delivery of a turnkey product to our clients.
Photoresist Application
In order to prevent contamination or damage during the laser ablation process a 3-5μm thick photoresist layer is applied to the wafer surface in a clean room environment.
Laser Etch
Each new wafer is marked with the host wafers’ ID and location reference information.
Edge Beveling
This is a mechanical grinding process which rounds the edges of the newly created wafers and renders the wafer robust for further handling while enhancing its resistance to mechanical stress.
Photoresist Strip
The photoresist layer is removed in a clean room environment, stripping away any debris or contamination in contact with the resist layer.
Cleaning
As a precleaning step the wafers are sent through a standard spin, rinse and dry process. The primary cleaning process is the industry standard SC-1 and SC-2. All of the cleaning and eventual packaging is performed in a class 100 clean room.