External Services Managed by WaferFab Services

We provide a number of services that complement our laser processes. These processes are managed by WaferFab Services  to allow delivery of a turnkey product  to our clients.

Photoresist Application   In order to prevent contamination or damage during the coring process a 3-5μm thick photoresist layer is applied to the wafer surface in a clean room environment.

Laser Etch   Each new wafer can be marked with the host wafers' ID and location reference information.

Edge Beveling   This is a mechanical grinding process which shapes the edges of the newly created wafers and renders the wafer robust for further handling while enhancing its resistance to mechanical stress.

Photoresist Strip   The photoresist layer is removed in a clean room environment, stripping away any debris or contamination in contact with the resist layer.

Cleaning   As a precleaning step the wafers are sent through a standard spin, rinse and dry process.  All of the cleaning and eventual packaging is performed in a class 100 clean room.