American Precision Dicing began dicing hard brittle materials with only two sawing tools in a garage back in the early 1990s. Over time, the company has evolved into one of the leading dicing facilities in the US. Currently, we have a stable of sawing tools that allow us to cut wafers with diameters up to 300 mm. In 2006 we established the Laser Services Group as a division of APD. This division was tasked with developing processes utilizing laser cutting machines to complement our traditional sawing process. Consequently, we now have the ability to make non linear cuts into various materials. This allows us to cut more complex geometries. Our Laser Services Group provides services to start-ups as well as fortune 500 companies worldwide. Low volume quick turn projects are our specialty. Some projects are completed the same day material arrives. Looking forward we will continue to expand into other services within the semiconductor industry as well as expand our tooling capabilities.