Removal of Intellectual Property Process
Some Integrated Circuit foundries can place several designs from multiple customers on one wafer called a Multi-Project Wafer, or MPW. This sharing of wafer masks saves customers money because IC fabrication costs are very high. Foundries also use the term "shuttle runs" in reference to MPWs.RIP, or Removal of Intellectual Property, is a laser process LSG developed to remove other customers' integrated circuit designs from an MPW while leaving specified IC designs intact. This allows standard wafer level testing to be performed instead of die level testing. In many cases, the entire RIP process can be completed within 48 hours.
WaferFab Services 646 Giguere Court, San Jose, CA, 95133, USA +1(408)539-9880 sales@wafer-dicing.com
Copyright American Precision Dicing, Inc. - 2020